Publications by Lee Levine (Page2)
Topic File(.pdf) Title General advmejan02 Wire Bonding in Optoelectronics CSR_ShrTestWB Should we Pull Test and Shear Test Fine-Pitch Wedge and Ribbon Bonds EFOPolarity Positive Results from a Negative EFO ISHM95D The Ultrasonic Wedge Bonding Mechanism: Two Theories Converge ISHM97I Integrated Solutions to Bonding BGA Packages:
Capillary Wire and Machine Considerations levine feature2b New Trends in Wire Bond Packaging optimize DOE How to Optimize and Control the Wire Bonding Process: Part 1 & 2 S17_Gahagan Assesing Pad Damage and Bond Integrity for Fine Pitch Probing SEMI99 Very Fine Pitch Wire Bonding: Reexamining Wire, Bonding Tool
and Wire Bonding Interrelationships for Opyimum Process Capability SemiconChina2006Looping Advanced Ultra-Low-Loop Wire Bonds sst799 Choosing Capillaries for fine pitch bonding wire bonding Step by Step Wire Bonding Chinese EMC 0401(34-35) In Chinese Wire Bond Looping Low K K&S_LowK_finrevc Probing wire bond issues for bonding over Cu low K dielectric materials